TMF fabricated three modular E-Houses for Intel’s Hillsboro campus, providing precision-built enclosures for critical electrical infrastructure.
For Intel’s Hillsboro, Oregon campus, Thompson Metal Fab designed and fabricated three modular E-Houses—MBR, Thermal, and Chiller—for Integrated Systems Group. Drawing on experience from oil and gas modularization, TMF delivered these electrical support buildings with fully integrated design and engineering. The MBR and Thermal units each measured 22 by 75 by 13 feet, while the Chiller was slightly smaller at 18 by 55 by 13 feet. TMF’s modular fabrication approach allowed for faster deployment and minimized on-site construction. The project reflects TMF’s growing role in the fabrication of highly specialized modular buildings for high-tech infrastructure.
TMF built and delivered three fully integrated modular E-Houses for Intel.
